D03-Advanced Thermal Functional  Materials

Symposium Introduction

With the rapid development of high-power and highly integrated devices, thermal management has become essential for improving device performance and reliability. This symposium will focus on advanced thermal management materials, including highly thermally conductive materials, thermal interface materials, thermoelectric materials, thermal protection materials, flexible thermal management materials, and electronic packaging materials. It aims to provide a forum for discussing recent progress in heat transport mechanisms, materials design, simulations, fabrication, and applications.

Symposium Topics

1. Nanoscale Thermoelectric Materials
2. Thermal Protection Materials
3. Thermal Interface Materials
4. Advanced Theory for Thermal Control
5. Advanced Electronic Packaging Materials
6. Highly thermally conductive Materials
7. Flexible Thermal Management Materials  

8. AI for Multiscale Thermal Transport and Materials Design

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Symposium Organizers 

Organized by

Beijing Institute of Technology

Supported by

Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology

Contact with

Name: Wentao Chen

Phone:+86-19918150004

E-mail: wentao.chen@bit.edu.cn

Institution: Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology