H09-Electronic Materials and Chemicals for Advanced Packaging and Heterogeneous Integration

Symposium Introduction

Advanced packaging is a materials-intensive route to higher integration density, improved signal integrity and reliable electronic systems. Chiplets, three-dimensional integration, high-frequency interconnects and optoelectronic integration require coordinated advances in molecular design, electronic chemicals, processing and interface reliability. A central challenge is to reconcile low dielectric constant and loss with dimensional stability, thermal management, adhesion and process compatibility.
This symposium will bring together young scientists and engineers working on polymer dielectrics, functional organosilicon materials, photo-patternable resins, high-purity electronic chemicals and packaging interfaces. Particular attention will be given to benzocyclobutene (BCB), polyimides, polyphenylene ether (PPE), hydrocarbon resins and organic-inorganic hybrids; photosensitive dielectrics and dry films; low-temperature curing, temporary bonding and debonding; and materials for redistribution layers, glass interposers and heterogeneous integration. Optical encapsulation and flexible electronic materials will provide complementary perspectives.
The scientific program will connect molecular structure and reaction mechanisms with film formation, interfacial transport, thermomechanical behavior and device-level validation. It will also address synthesis scale-up, trace-impurity control, reproducibility and data-assisted materials development. English-language invited lectures, contributed talks, poster presentations and a young-researcher discussion will foster international exchange between materials chemistry, chemical engineering and microelectronics. The proposed scope draws on the complementary research communities of the Chinese Chemical Society Committee on Electronic Information Chemicals and the Electronic Chemicals Committee of the Chemical Industry and Engineering Society of China; institutional support remains subject to confirmation.

Symposium Topics

1. Molecular design and network engineering of low-loss polymer dielectrics: BCB, polyimides, PPE, hydrocarbon resins and organic-inorganic hybrids.
2. Photo-patternable electronic polymers and dry films: photoresists, photosensitive dielectrics, photochemistry and fine-pattern fabrication.
3. Low-temperature curing, adhesion and bonding materials for redistribution layers, chiplets and 2.5D/3D heterogeneous integration.
4. Packaging interfaces and thermomechanical reliability: underfills, molding compounds, low-CTE composites, thermal transport and failure mechanisms.
5. Functional organosilicon and optical encapsulation materials for integrated photonics, co-packaged optics, Micro-LED and flexible electronics.
6. High-purity electronic chemicals and key monomers: selective synthesis, purification, trace analysis, contamination control and scale-up.
7. Materials-process co-design and validation for wafer/panel-level packaging, glass interposers and through-glass vias.
8. Data-assisted materials discovery, multiscale characterization and reproducible benchmarking of electronic materials.

Symposium Organizers 

Organized by

Wenxin Fu Research Team, Institute of Chemistry, Chinese Academy of Sciences (proposed lead organizing team).

Supported by

Proposed academic support, subject to confirmation: Committee on Electronic Information Chemicals, Chinese Chemical Society; Electronic Chemicals Committee, Chemical Industry and Engineering Society of China. 

Contact with

Name: Zhang Wenxing

Phone: +86-18810331362

Email: zhangwenxing@iccas.ac.cn

Institution: Institute of Chemistry Chinese Academy of Sciences (ICCAS)

Name: Liu Qitan

Phone: +86-15307271290

Email: liuqitan@iccas.ac.cn

Institution: Institute of Chemistry Chinese Academy of Sciences (ICCAS)

Remark

Chair profile: Wenxin Fu is an ICCAS Professor working on BCB-based polymer dielectrics, molecular topology, hybrid interfaces and photosensitive packaging materials. He has led NSFC projects, including the Excellent Young Scientists Fund (Overseas), and serves on both electronic-chemicals committees named above. His work connects polymer chemistry with processing and application validation.